Solder Paste Analysis

The SPA 1000 Solder Paste Analyser

A unique six-in-one test system used to characterise solder paste in compliance with both IPC and IEC Standards.

The SPA 1000 also introduces new process control capability by accurately measuring the suitability of the solder paste prior to its implementation on the production line. It achieves this by determining the "Open-Time" for the paste. It also performs the Slump Test and both of these methods provide a "Go/No Go" answer in less than 30 minutes to ensure minimum delay for the production line.

NEW Process Control Test Methods Solder Paste Standard is available in the members area of SMART Group web site: www.smartgroup.org quoting document reference SGPCT01.

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